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Tenders from Silicon Austria Labs GmbH

Review recent public procurement notices from Silicon Austria Labs GmbH and create an alert when this buyer publishes opportunities relevant to your business.

Quality-indexed notices35
Upcoming deadlines0
Latest publicationJun 25, 2026
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Recent tender notices

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TEDPublished Oct 7, 2025

Silicon Austria Labs – Chips JU: Thermal processing [magnetic annealing furnace]

Silicon Austria Labs GmbH

The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation, commissioning as well as optional services (after warranty) of a magnetic annealing tool furnace for Silicon Austria Labs...

TEDPublished Sep 1, 2025

Silicon Austria Labs – Chips JU: Wafer bumper

Silicon Austria Labs GmbH

The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of an automated wafer soldering bumping tool as well as services such as trainings for Silicon Austria L...

TEDPublished Aug 13, 2025

Silicon Austria Labs – Chips JU: Wafer bumper & reflow

Silicon Austria Labs GmbH

The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of an automated wafer soldering bumping and reflow tool as well as services such as trainings for Silico...

TEDPublished Aug 8, 2025

Silicon Austria Labs – Chips JU: Nitride Cluster Tool

Silicon Austria Labs GmbH

The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of a Nitride Cluster Tool as well as related services such as trainings, for Silicon Austria Labs GmbH.

TEDPublished Aug 1, 2025

Silicon Austria Labs – Chips JU: Nitride Cluster Tool

Silicon Austria Labs GmbH

The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of a Nitride Cluster Tool as well as related services such as trainings, for Silicon Austria Labs GmbH.

TEDPublished Jul 11, 2025

Silicon Austria Labs – Chips JU: Wafer bumper & reflow

Silicon Austria Labs GmbH

The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of an automated wafer soldering bumping and reflow tool as well as services such as trainings for Silico...

TEDPublished Jun 30, 2025

Silicon Austria Labs – Chips JU: Nitride Cluster Tool

Silicon Austria Labs GmbH

The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of a Nitride Cluster Tool as well as related services such as trainings, for Silicon Austria Labs GmbH.

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