Silicon Austria Labs – Chips JU: Wafer bumper & reflow
- Buyer
- Silicon Austria Labs GmbH
- Published
- August 13, 2025
Description
The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of an automated wafer soldering bumping and reflow tool as well as services such as trainings for Silicon Austria Labs GmbH.
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