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Tenders from Silicon Austria Labs GmbH

Review recent public procurement notices from Silicon Austria Labs GmbH and create an alert when this buyer publishes opportunities relevant to your business.

Quality-indexed notices35
Upcoming deadlines0
Latest publicationJun 25, 2026
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Recent tender notices

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TEDPublished Jun 25, 2026

Silicon Austria Labs – Magnetic Wafer Prober

Silicon Austria Labs GmbH

The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation, commissioning and associated services (including documentation and trainings) of an automated magnetic wafer probing syst...

Deadline Jul 13, 2026
TEDPublished Jun 5, 2026

Silicon Austria Labs – Magnetic Wafer Prober

Silicon Austria Labs GmbH

The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation, commissioning and associated services (including documentation and trainings) of an automated magnetic wafer probing syst...

Deadline Jul 6, 2026
TEDPublished May 20, 2026

Silicon Austria Labs – Magnetic thick film sputter tool

Silicon Austria Labs GmbH

The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation, commissioning and services (such as trainings) of a magnetic thick film sputter tool for Silicon Austria Labs GmbH.

Deadline Jun 18, 2026
TEDPublished Apr 10, 2026

Silicon Austria Labs – Rapid thermal processing

Silicon Austria Labs GmbH

The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of a Rapid Thermal Annealing (RTA) tool for the fabrication of various thin films as described below for...

TEDPublished Apr 9, 2026

Silicon Austria Labs – Chips JU: Plasma Asher

Silicon Austria Labs GmbH

The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation, commissioning and services (such as trainings) of a single wafer ashing tool for Silicon Austria Labs GmbH.

TEDPublished Mar 26, 2026

Silicon Austria Labs – Automated Spectroscopic Ellipsometer

Silicon Austria Labs GmbH

The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation, commissioning and services (such as trainings) of an Automated Spectroscopic Ellipsometer (ASE) for Silicon Austria Labs...

TEDPublished Mar 24, 2026

Silicon Austria Labs – Chips JU: Plasma Activation system for D2W bonding

Silicon Austria Labs GmbH

The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation, commissioning and services (such as trainings) of a wafer-level plasma activation system for wafer bonding application fo...

TEDPublished Mar 20, 2026

Hybrid Wafer Bonding

Silicon Austria Labs GmbH

Ziel dieses Vergabeverfahrens ist es, den im Rahmen des Verfahrens zu ermittelnden Bestbieter für die Lieferung, Installation, Inbetriebnahme sowie die Erbringung von Dienstleistungen für ein Hybrid-Wafer-Bonding-System auszuwählen.

TEDPublished Mar 20, 2026

Silicon Austria Labs – Rapid thermal processing

Silicon Austria Labs GmbH

The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of a Rapid Thermal Annealing (RTA) tool for the fabrication of various thin films as described below for...

TEDPublished Mar 6, 2026

Silicon Austria Labs – Chips JU: Plasma Asher

Silicon Austria Labs GmbH

The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation, commissioning and services (such as trainings) of a single wafer ashing tool for Silicon Austria Labs GmbH.

TEDPublished Feb 27, 2026

Silicon Austria Labs – Chips JU: Single wafer wet clean tool

Silicon Austria Labs GmbH

The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation, commissioning and services (such as trainings) of a single wafer wet clean tool for Silicon Austria Labs GmbH.

TEDPublished Feb 25, 2026

Silicon Austria Labs – Chips JU: Plasma Activation system for D2W bonding

Silicon Austria Labs GmbH

The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation, commissioning and services (such as trainings) of a wafer-level plasma activation system for wafer bonding application fo...

TEDPublished Feb 4, 2026

Silicon Austria Labs – Chips JU: LPCVD Furnace

Silicon Austria Labs GmbH

The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation, commissioning and services (such as trainings) of a LPCVD tool for surface passivation/encapsulation and hard mask deposi...

TEDPublished Dec 19, 2025

Silicon Austria Labs – Laser drilling machine for fan-out wafer level packaging

Silicon Austria Labs GmbH

The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of a laser drilling machine for fan-out wafer level packaging as described below for Silicon Austria Lab...

TEDPublished Dec 11, 2025

Silicon Austria Labs – Chips JU: Ion Beam Trimming Tool

Silicon Austria Labs GmbH

The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of an ion beam trimming tool for Silicon Austria Labs GmbH.

TEDPublished Nov 19, 2025

Silicon Austria Labs – Frame / wafer cleaning unit

Silicon Austria Labs GmbH

The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation, commissioning as well as optional services such as trainings of a frame / wafer cleaning unit for Silicon Austria Labs GmbH.

TEDPublished Nov 19, 2025

Silicon Austria Labs – Laser drilling machine for fan-out wafer level packaging

Silicon Austria Labs GmbH

The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of a laser drilling machine for fan-out wafer level packaging as described below for Silicon Austria Lab...

TEDPublished Nov 17, 2025

Silicon Austria Labs – Photonic debonder (manual/ semi-automated)

Silicon Austria Labs GmbH

The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation, commissioning as well as services such as trainings of a Photonic debonder (manual/ semi-automated) for Silicon Austria L...

TEDPublished Nov 12, 2025

Silicon Austria Labs – Chips JU: Thermal processing [magnetic annealing furnace]

Silicon Austria Labs GmbH

The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation, commissioning as well as optional services (after warranty) of a magnetic annealing tool furnace for Silicon Austria Labs...

TEDPublished Nov 11, 2025

Silicon Austria Labs – Chips JU: Ion Beam Trimming Tool

Silicon Austria Labs GmbH

The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of an ion beam trimming tool for Silicon Austria Labs GmbH.

TEDPublished Oct 24, 2025

Silicon Austria Labs – Chips JU: Thermal processing [magnetic annealing furnace]

Silicon Austria Labs GmbH

The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation, commissioning as well as optional services (after warranty) of a magnetic annealing tool furnace for Silicon Austria Labs...

TEDPublished Oct 23, 2025

Silicon Austria Labs – Chips JU: Resist processing system

Silicon Austria Labs GmbH

The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of a resist processing system for Silicon Austria Labs GmbH.

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