Silicon Austria Labs – Chips JU: Plasma Activation system for D2W bonding
- Buyer
- Silicon Austria Labs GmbH
- Published
- February 25, 2026
Description
The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation, commissioning and services (such as trainings) of a wafer-level plasma activation system for wafer bonding application for Silicon Austria Labs GmbH.
Get tenders like this in one daily alert
Use this notice as context when Tenqual drafts your search scope and fit criteria.