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SAM.govNotice 07f5c5bb7eac41e8906cac1d753df986

CHIPS R&D Bond Strength Tester

Country
United States
Published
February 3, 2026
Deadline
February 16, 2026

Description

Solicitation Number: 1333ND26QNB030040 Type: Combined Synopsis/Solicitation Base Type: Sources Sought NAICS: 334519 Classification Code: 5961 Response Deadline: 2026-02-16T11:00:00-05:00 Office Address: GAITHERSBURG, MD Place of Performance: Boulder, Colorado POC: Tracy Retterer, Tracy.retterer@nist.gov POC: Donald Collie, donald.collie@nist.gov

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CHIPS R&D Bond Strength Tester tender | Tenqual