APECS/INL-17 - CONTRACT FOR THE SUPPLY AND INSTALLATION OF EQUIPMENT AND COMPONENTS WITHIN APECS (ADVANCED PACKAGING AND HETEROGENEOUS INTEGRATION FOR ELECTRONICS COMPONENTS AND SYSTEMS) PILOT LINE

Description

The subject matter of this contract is the supply and installation of scientific equipment and components to INL, listed below and detailed in Schedule V attached to these Standard Specifications (from now on referred to as ‘Specifications’). The equipment listed in Schedule V are the lots that the tender comprises. Tenderers may bid for one or more lots. The subject matter of the contract, in all cases, does not include so-called refurbished scientific instruments and equipment. The single lot comprising the tender is as follows: 1. Pick and Place equipment upgrade: • Wafer Holder • Die Eject Module • Flip Chip Module The project is funded by ANI - Agencia Nacional de Inovação under the Joint Procurement Agreement signed between INL and Chips JU.