Smash Program Announcement

Description

{"description":"The Defense Advanced Research Projects Agency (DARPA) is soliciting innovative proposals around materials processing to enable efficient, scalable element separation across the periodic table. This capability would establish a new technological basis for domestic resource independence. Specifically, the Smash program aims to create technologies that leverage parallel processing to: (1) drive process yield across multiple elements; (2) maximize energy utilization in the intrinsic separation processes; and (3) ensure solutions are scalable across industrial processing operations. Proposed research should investigate innovative approaches that enable revolutionary advances in science, devices, or systems. Specifically excluded is research that primarily results in evolutionary improvements to the existing state of practice. Note: The referenced Attachment J: Smash Controlled Unclassified Information (CUI) Guide is under final review will be posted subsequently."} Solicitation Number: DARPA-PA-26-04 Type: Solicitation Base Type: Solicitation NAICS: 541715 Classification Code: AC12 Response Deadline: 2026-04-29T17:00:00 Office Address: ARLINGTON, VA POC: Smash PA Coordinator, Smash@darpa.mil