Back to search
SAM.govNotice 7ea2c8180e6c4ffeb4313d94eba4b77e

CHIPS High-Throughput High-Resolution X-ray Laminography/Tomography System for Advanced Packaged Semiconductor Devices and Substrates

Country
United States
Published
February 12, 2026
Deadline
February 26, 2026

Description

{"description":" See Combined Synopsis Solicitation_1333ND26QNB030031, Attachment 1 - Statement of Work, and Attachment 2 - Applicable Provisions and Clauses attachments for solicitation details. \n"} Solicitation Number: 1333ND26QNB030031 Type: Combined Synopsis/Solicitation Base Type: Sources Sought NAICS: 334413 Classification Code: 6640 Response Deadline: 2026-02-26T11:00:00-05:00 Office Address: GAITHERSBURG, MD Place of Performance: Gaithersburg, Maryland, 20899 POC: Tracy Retterer, Tracy.retterer@nist.gov POC: Donald Collie, donald.collie@nist.gov {"description":" See Combined Synopsis Solicitation_1333ND26QNB030031, Attachment 1 - Statement of Work, and Attachment 2 - Applicable Provisions and Clauses attachments for solicitation details. \n"}

Open original notice

Get tenders like this in one daily alert

Use this notice as context when Tenqual drafts your search scope and fit criteria.

Create free alert
CHIPS High-Throughput High-Resolution X-ray Laminography/Tomography System for Advanced Packaged Semiconductor Devices and Substrates tender | Tenqual