Semiconductor Die Bonding and Vacuum Packaging System
- Buyer
- DEPT OF DEFENSE.DEPT OF THE NAVY.ONR.ONR NRL.NAVAL RESEARCH LABORATORY
- Country
- United States
- Published
- June 16, 2026
- Deadline
- July 1, 2026
Description
Solicitation Number: N00173-26-RFI-KN02 Type: Sources Sought Base Type: Sources Sought Response Deadline: 2026-07-01T12:00:00-04:00 Office Address: WASHINGTON, DC Place of Performance: District of Columbia, 20375 POC: KEVIN NGUYEN, kevin.nguyen3.civ@us.navy.mil POC: Jamie Dixon, jamie.l.dixon8.civ@us.navy.mil, (202)923-1466
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