Supply, Delivery and Installation of Inductively Coupled Plasma Chemical Vapour Deposition System
University of Strathclyde
Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilit...
Deadline Sep 9, 2026