Delivery and installation of a ICP Reactive ion etcher for silicon dielctrics
Danmarks Tekniske Universitet - DTU
DTU Nanolab wishes to acquire a high ion density source reactive ion etcher for oxides and nitrides of silicon to become its new primary instrument for 150 mm wafer processing. Delivery is expected no later than Q3 2027. The Instrument will be installed in the DTU Nanolab clea...
Deadline Nov 23, 2026