Use this page to review recent public tenders from Silicon Austria Labs GmbH, see how active this buyer is, and open the underlying notice pages in Tenqual.
Recent notices from this buyer are listed below when available.
The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation, commissioning, and associated services (including documentation and trainings) of modules enabling the extension of the rang
The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of a Rapid Thermal Annealing (RTA) tool for the fabrication of various thin films as described below for Si
The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation, commissioning and services (such as trainings) of a single wafer ashing tool for Silicon Austria Labs GmbH.
The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation, commissioning and services (such as trainings) of an Automated Spectroscopic Ellipsometer (ASE) for Silicon Austria Labs Gmb
The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation, commissioning and services (such as trainings) of a wafer-level plasma activation system for wafer bonding application for S
The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of a Rapid Thermal Annealing (RTA) tool for the fabrication of various thin films as described below for Si
Ziel dieses Vergabeverfahrens ist es, den im Rahmen des Verfahrens zu ermittelnden Bestbieter für die Lieferung, Installation, Inbetriebnahme sowie die Erbringung von Dienstleistungen für ein Hybrid-Wafer-Bonding-System auszuwählen.
The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation, commissioning and services (such as trainings) of a single wafer ashing tool for Silicon Austria Labs GmbH.
The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation, commissioning and services (such as trainings) of a single wafer wet clean tool for Silicon Austria Labs GmbH.
The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation, commissioning and services (such as trainings) of a wafer-level plasma activation system for wafer bonding application for S
The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation, commissioning and services (such as trainings) of a LPCVD tool for surface passivation/encapsulation and hard mask depositio
The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of a Total Reflection X-Ray Fluorescence Spectrometer (TXRF) for Silicon Austria Labs GmbH.
The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of a laser drilling machine for fan-out wafer level packaging as described below for Silicon Austria Labs G
The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of an ion beam trimming tool for Silicon Austria Labs GmbH.
The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of a laser drilling machine for fan-out wafer level packaging as described below for Silicon Austria Labs G
The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation, commissioning as well as optional services such as trainings of a frame / wafer cleaning unit for Silicon Austria Labs GmbH.
The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation, commissioning as well as services such as trainings of a Photonic debonder (manual/ semi-automated) for Silicon Austria Labs
The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of an in-line metrology tool for thin-film measurements for Silicon Austria Labs GmbH.
The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation, commissioning as well as optional services (after warranty) of a magnetic annealing tool furnace for Silicon Austria Labs Gm
The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of an ion beam trimming tool for Silicon Austria Labs GmbH.
The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation, commissioning as well as optional services (after warranty) of a magnetic annealing tool furnace for Silicon Austria Labs Gm
The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of a resist processing system for Silicon Austria Labs GmbH.
The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation, commissioning as well as optional services (after warranty) of a magnetic annealing tool furnace for Silicon Austria Labs Gm
The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of an automated wafer soldering bumping tool as well as services such as trainings for Silicon Austria Labs
The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of a manual or semi-automated wafer reflow vacuum oven as well as services such as trainings for Silicon Au