Review recent public procurement notices from VTT Technical Research Centre of Finland Ltd and create an alert when this buyer publishes opportunities relevant to your business.
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VTT Technical Research Centre of Finland Ltd
The object of the tender process is the complete STA-GC-MS system that shall comprise the following integrated and fully validated modules, all supplied and commissioned by a single vendor: • Module 1 — Simultaneous Thermal Analyzer (STA/TGA-DSC) • Module 2 — Heated Transfer S...
Deadline Aug 3, 2026VTT Technical Research Centre of Finland Ltd
VTT is looking to acquire an automated defect inspection tool for 200 mm and 300 mm patterned wafers. The tool will enable rapid tracking of defects that appear during the manufacturing process of functional devices (in-line and end-of-line in the Front-end process). The tool...
Deadline Jun 22, 2026VTT Technical Research Centre of Finland Ltd
Automated mass comparator to enable fully automatic calibration of OIML class weights in the range from 10 g to 1000 g. The object of the tender process is described in more detail in the invitation to tender documents.
Deadline Jun 29, 2026VTT Technical Research Centre of Finland Ltd
THE OBJECT OF THE TENDER PROCESS The object of the procurement is a 200 mm automated film stress and wafer bow analysis system using a non-contact laser scanning technique for the VTT Micronova cleanroom. The procurement includes a room temperature automated thin-film stress m...
Deadline May 28, 2026VTT Technical Research Centre of Finland Ltd
The object of the tender is an inline process light microscope capable of imaging eukaryotic cells inside a bioreactor without dying or sampling. The object of the tender process is described in more detail in the invitation to tender documents.
VTT Technical Research Centre of Finland Ltd
The object of the tender is 200 mm wafer particle beam trimming tool for VTT Micronova cleanroom semiconductor front end processing. The particle beam may be an ion beam, or a gas cluster beam, with a full width at half maximum within 3-15 mm. The tool must be compatible with...
VTT Technical Research Centre of Finland Ltd
The object of the tender is semi-automatic wafer metrology tool (later also “tool”) for measurement of total thickness, TTV (total thickness variation), warp, bow, metallization bumps, trench or via depth and geometric factors in substrates typical in semiconductor industry su...
VTT Technical Research Centre of Finland Ltd
THE OBJECT OF THE TENDER PROCESS The object of the procurement is DUV Stepper 200 mm. The technical specification of the object of the tender and its minimum requirements is described in more detail in this Annex 1 of the invitation to tender. The tendered Tool must comply wit...
VTT Technical Research Centre of Finland Ltd
The object of the tender is Large-area offline vacuum lamination equipment. Purpose of use includes, but is not limited to, bonding films or sheets together to produce bubble-free multilayer laminates, and coverlay/protective lamination with thermoplastic adhesive systems. Mai...
VTT Technical Research Centre of Finland Ltd
The object of the tender process is to find a service provider for Employee Engagement Survey Services (later “Service”). VTT is looking for a service provider, who will provide a scientifically validated survey model, modern and user-friendly online platform for the survey, c...
VTT Technical Research Centre of Finland Ltd
The object of the tender process is a Kelvin probe force microscopy (KPFM) equipped with atomic force microscopy (AFM) functionality, a state-of-the-art detector system, and equipment for advanced material surface potential mapping with an efficient spatial resolution and a mi...
VTT Technical Research Centre of Finland Ltd
THE OBJECT OF THE TENDER PROCESS The object of the procurement is 200 mm wafer coating and developing track tool for VTT Micronova cleanroom semiconductor front end processing. The procurement involves a tool integrated into a DUV exposure tool, but also capable of developing...
VTT Technical Research Centre of Finland Ltd
THE OBJECT OF THE TENDER PROCESS The object of the procurement is 200 mm wafer coating and developing track tool for VTT Micronova cleanroom semiconductor front end processing. The procurement involves a tool integrated into a DUV exposure tool, but also capable of developing...
VTT Technical Research Centre of Finland Ltd
THE OBJECT OF THE TENDER PROCESS The object of the procurement is 200 mm wafer coating and developing track tool for VTT Micronova cleanroom semiconductor front end processing. The procurement involves a tool integrated into a DUV exposure tool, but also capable of developing...
VTT Technical Research Centre of Finland Ltd
The object of the tender is a Semi-Automatic Wafer Grinder with manual wafer loading and unloading on the chuck table (later also “Equipment”), capable of thinning Si, SiC, LiNbO3 and other typical semi-conducting wafers of 200 and 300 mm diameter to varying thicknesses with e...
VTT Technical Research Centre of Finland Ltd
Procurement targets are services related to system, design, delivery, and support service of an Identity governance and administration (IGA) solution. The objectives for the solution include: • Simplify the current architecture. • Enhance access review capabilities. • Increase...
Deadline Aug 27, 2025VTT Technical Research Centre of Finland Ltd
The object of the tender process is a carbonization and activation unit. Continuously fed electrically heated rotary kiln carbonization and activation unit built into a sea container. The unit is suitable for both carbonization and activation with maximum temperature at least...
Deadline Jul 29, 2025Tenqual applies your keywords and filters first, then uses the fit criteria you approve to classify every candidate.