Purchaser
University of Bristol
Country
United Kingdom
Notice published
1 Jul 2026
Tenqual indexed
2 Jul 2026
Closing date
16 Jul 2026
Source ID
Docs found
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Tender summary
Funding is available to purchase a die attach/bonding system capable of performing a wide range of bonding processes, including ultrasonic, flip-chip, and UV curing, which is suitable for prototyping and light production runs. As a result, a crucial aspect for any die attach system under is the ability to be used for bonding runs as small as a single die should this be required. This stipulation lends itself to a semi-automated (i.e. motorised) system, ideally with the capacity to store process recipes to maximise reproducibility should the system be used for light production runs.
What to check before bidding
- Issued by University of Bristol.
- Located in United Kingdom.
- Source notice 21933349-7465-49c1-a0c0-59f1caeb33ed-904105 on uk.
- Notice published 1 Jul 2026; Tenqual indexed it 2 Jul 2026.
- Deadline listed as 16 Jul 2026.
- Create a free tender alert to catch similar opportunities before the deadline pressure starts.