SAM.gov
Multichip Module Package for SiC Pressure Sensors
Purchaser
NATIONAL AERONAUTICS AND SPACE ADMINISTRATION.NATIONAL AERONAUTICS AND SPACE ADMINISTRATION.NASA SHARED SERVICES CENTER
Country
United States
Notice published
26 Jun 2026
Tenqual indexed
27 Jun 2026
Closing date
30 Jun 2026
Source ID
Docs found
—
Track tenders like this
Save this notice and create a free tender alert for similar public opportunities.
- Create one free tender alert.
- See a short explanation of why each tender matches.
- Upgrade later when you want help planning and writing the bid.
Tender summary
Solicitation Number: 80NSSC26936730Q Type: Combined Synopsis/Solicitation Base Type: Combined Synopsis/Solicitation NAICS: 334419 Classification Code: 6695 Response Deadline: 2026-06-30T07:00:00-05:00 Office Address: STENNIS SPACE CENTER, MS Place of Performance: Cleveland, Ohio, 44135 POC: Shanna Patterson, shanna.l.patterson@nasa.gov
What to check before bidding
- Issued by NATIONAL AERONAUTICS AND SPACE ADMINISTRATION.NATIONAL AERONAUTICS AND SPACE ADMINISTRATION.NASA SHARED SERVICES CENTER.
- Located in United States.
- Source notice be8e1f1156144652a73c065ffad6e328 on SAM.gov.
- Notice published 26 Jun 2026; Tenqual indexed it 27 Jun 2026.
- Deadline listed as 30 Jun 2026.
- Create a free tender alert to catch similar opportunities before the deadline pressure starts.