Purchaser
VTT Technical Research Centre of Finland Ltd
Country
Finland
Notice published
16 Jun 2026
Tenqual indexed
16 Jun 2026
Closing date
22 Jun 2026
Source ID
Docs found
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Tender summary
VTT is looking to acquire an automated defect inspection tool for 200 mm and 300 mm patterned wafers. The tool will enable rapid tracking of defects that appear during the manufacturing process of functional devices (in-line and end-of-line in the Front-end process). The tool must be capable of detecting particles, voids, cracks, scratches, pits, bumps, and hazes in the pattern. The materials of the patterns that the machine must be able to analyze are silicon oxides and nitrides, polysilicon, metals, and photoresist. The object of the tender process and the technical requirements are described in more detail in the invitation to tender documents.
What to check before bidding
- Issued by VTT Technical Research Centre of Finland Ltd.
- Located in Finland.
- Source notice 413000-2026 on TED.
- Notice published 16 Jun 2026; Tenqual indexed it 16 Jun 2026.
- Deadline listed as 22 Jun 2026.
- Create a free tender alert to catch similar opportunities before the deadline pressure starts.