The Supply, Delivery and Validation of a Digital Microscope System for Tyndall National Institute, University College Cork

Tender summary

Tenders are required to provide a digital microscope system for advanced inspection, characterization, imaging, and dimensional analysis of electronic and microelectronic structures. The system will be used for high-resolution observation and measurement of multilayer PCB structures, integrated circuit dies, semiconductor devices, 3D-printed electronic components, interconnects, solder joints, micro-vias, and related laboratory samples. The proposed system must provide integrated hardware and software capabilities for high-resolution imaging, 2D and 3D measurement, surface profiling, focus stacking, image stitching, tilted observation, and automated repetition of setup conditions such as image capturing and 2D/3D surface characterization. The system must operate as a fully integrated bench-top solution, including embedded computing and all software licenses required for measurement, characterization, image acquisition, analysis, and data export.

What to check before bidding

• Issued by University College Cork.
• Located in Ireland.
• Source notice 412329-2026 on TED.
• Notice published 16 Jun 2026; Tenqual indexed it 16 Jun 2026.
• Deadline listed as 30 Jun 2026.
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