Purchaser
VTT Technical Research Centre of Finland Ltd
Country
Finland
Notice published
28 Apr 2026
Tenqual indexed
30 Apr 2026
Closing date
Not listed
Source ID
Docs found
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Tender summary
The object of the tender is semi-automatic wafer metrology tool (later also “tool”) for measurement of total thickness, TTV (total thickness variation), warp, bow, metallization bumps, trench or via depth and geometric factors in substrates typical in semiconductor industry such as but not limited to silicon wafers, chips, stacked wafers, stacked chips, samples containing mixed oxides, or/and thin materials deposited. The tool must be compatible with installation in an ISO 4 classified cleanroom. The object of the tender process is described in more detail in the invitation to tender documents.
What to check before bidding
- Issued by VTT Technical Research Centre of Finland Ltd.
- Located in Finland.
- Source notice 290369-2026 on TED.
- Notice published 28 Apr 2026; Tenqual indexed it 30 Apr 2026.
- No closing date is listed yet.
- Create a free tender alert to catch similar opportunities before the deadline pressure starts.