TED
Dostawa Die bondera (flip-chip, eutektyka)
Purchaser
Sieć Badawcza Łukasiewicz - Instytut Mikroelektroniki i Fotoniki
Country
Poland
Published
12 Jan 2026
Closing date
Not listed
Source ID
Docs found
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Summary
Przedmiotem zamówienia jest dostawa, instalacja, uruchomienie i testowanie Die bondera (flip-chip, eutektyka) wraz ze szkoleniem i dokumentacją.
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