SAM.gov
Micro specimens of electroplated copper films and micro-sized lead-free solder for mechanical testing to fracture - Combined Sources Sought Notice/ Notice of Intent to Sole Source
Unknown purchaserUnited States
Purchaser
—
Country
United States
Published
20 Nov 2025
Closing date
3 Dec 2025
Source ID
Docs found
—
Create a free account to save this tender
Save this notice and create a tender alert for similar public opportunities.
- Create one free tender alert.
- See a short explanation of why each tender matches.
- Upgrade later when you want help planning and writing the bid.
Tender summary
Solicitation Number: NIST-SS26-CHIPS-04 Type: Sources Sought Base Type: Sources Sought NAICS: 541713 Classification Code: AJ12 Response Deadline: 2025-12-03T17:00:00-05:00 Office Address: GAITHERSBURG, MD Place of Performance: Boulder, Colorado, 80305 POC: Nina Lin, nina.lin@nist.gov POC: Donald Collie, donald.collie@nist.gov
What to check before bidding
- Located in United States.
- Deadline listed as 3 Dec 2025.
- Create a free tender alert to catch similar opportunities before the deadline pressure starts.