TED
Acquisition d'un système d'assemblage de composants par la méthode flip-chip (flip-chip bonder)
Purchaser
CNRS-Délégation Centre-Est
Country
France
Notice published
16 Oct 2025
Tenqual indexed
18 Oct 2025
Closing date
Not listed
Source ID
Docs found
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Tender summary
Acquisition d'un système d'assemblage de composants par la méthode flip-chip (flip-chip bonder) pour les besoins de FEMTO-ST
What to check before bidding
- Issued by CNRS-Délégation Centre-Est.
- Located in France.
- Source notice 679928-2025 on TED.
- Notice published 16 Oct 2025; Tenqual indexed it 18 Oct 2025.
- No closing date is listed yet.
- Create a free tender alert to catch similar opportunities before the deadline pressure starts.